Capacitor component

ABSTRACT

A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 μm or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the continuation application of U.S. patentapplication Ser. No. 16/879,980 filed on May 21, 2020, which claims thebenefit of priority to Korean Patent Application No. 10-2019-0082073filed on Jul. 8, 2019 in the Korean Intellectual Property Office, thedisclosures of which are incorporated herein by reference in theirentirety.

TECHNICAL FIELD

The present disclosure relates to a capacitor component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a capacitor component, hasadvantages such as compactness, guaranteed high capacitance, and ease ofmountability.

Recently, ceramic electronic components, in detail, multilayercapacitors, have significantly increased in capacitance. To securecapacitance, an effective margin and a thickness of a cover, anelectrode terminal, or the like, should be decreased. However, such astructural change may cause a deterioration in moisture resistancereliability.

In addition, defects may occur in an electrode terminal and an internalstructure of a body due to permeation of a plating solution during aplating process, which may cause a deterioration in reliability, indetail, a deterioration in characteristics and failure of a finalproduct during high temperature/high pressure driving.

SUMMARY

An aspect of the present disclosure is to provide a capacitor componentwhich may have improved moisture resistance reliability and may preventpermeation of a plating solution during a process and/or permeation ofexternal moisture during driving of a product.

According to an aspect of the present disclosure, a capacitor componentincludes a body including a dielectric layer, a first internal electrodeand a second internal electrode, laminated in a first direction,opposing each other, and a first cover portion and a second coverportion, disposed on outermost surfaces of the first and second internalelectrodes, each having a thickness of 25 μm or less, a first electrodelayer and a second electrode layer, respectively disposed on bothexternal surfaces of the body in a second direction perpendicular to thefirst direction and respectively connected to the first and secondinternal electrodes, and plating layers, respectively disposed on thefirst and second electrode layers. A metal oxide is disposed on aboundary between the first electrode layer and the plating layer and aboundary between the second electrode layer and the plating layer.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a capacitor componentaccording to an embodiment in the present disclosure;

FIG. 2 is a schematic perspective view of a body of FIG. 1 ;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1 ;

FIG. 4 is a cross-sectional view in X and Y directions of FIG. 1 , andillustrates a cross section in which a first internal electrode isvisible;

FIG. 5 is a cross-sectional view in X and Y directions of FIG. 1 , andillustrates a cross section in which a second internal electrode isvisible;

FIG. 6 is an enlarged view of portion A of FIG. 3 ;

FIG. 7 is a schematic diagram of an internal electrode according to anembodiment in the present disclosure;

FIG. 8 is a schematic diagram of an internal electrode according toanother embodiment in the present disclosure;

FIG. 9 is a cross-sectional view of a capacitor component according toan embodiment in the present disclosure; and

FIG. 10 is an enlarged view of portion B of FIG. 9 .

DETAILED DESCRIPTION

Hereinafter, example embodiments in the present disclosure will now bedescribed in detail with reference to the accompanying drawings. Thepresent disclosure may, however, be exemplified in many different formsand should not be construed as being limited to the specific embodimentsset forth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art. In the drawings,the shapes and dimensions of elements may be exaggerated for clarity.Further, in the drawings, elements having the same functions within thesame scope of the inventive concept will be designated by the samereference numerals.

Throughout the specification, when a component is referred to as“comprise” or “comprising,” it means that it may include othercomponents as well, rather than excluding other components, unlessspecifically stated otherwise.

In the drawings, an X direction may be defined as a first direction, anL direction, or a length direction, a Y direction may be defined as asecond direction, a W direction, or a width direction, and a Z directiondefined as a third direction, a T direction, or a thickness direction.

Hereinafter, a capacitor component according to an example embodiment inthe present disclosure will be described in detail with reference toFIGS. 1 to 7 .

A capacitor component 100 according to the present disclosure includes abody 110 including a dielectric layer 111, a first electrode 121 and asecond internal electrode 122, laminated in a first direction (a Zdirection), opposing each other, and a first cover portion and a secondcover portion, disposed on outermost portions of the first and secondinternal electrodes 121 and 122, each having a thickness of 25 μm orless, a first electrode layer 131 a and a second electrode layer 132 a,respectively disposed on both external surfaces of the body 110 in asecond direction (an X direction) perpendicular to the first direction(the Z direction) and respectively electrically connected to the firstand second internal electrodes 121 and 122, and plating layers 131 b and132 b, respectively disposed on the first and second electrode layers131 a and 132 a.

In this case, a metal oxide is disposed on a boundary between the firstelectrode layer 131 a and the plating layer 131 b and a boundary betweenthe second electrode layer 132 a and the plating layer 132 b.

In an embodiment, the body 110 may include dielectric layers 111, firstand second internal electrodes 121 and 122, and first and second coverportions.

The shape of the body 110 is not limited to any specific shape. However,as illustrated, the body 110 may have a hexahedral shape or a shapesimilar thereto. Due to shrinkage of ceramic powder particles includedthe body 110 during a sintering process, the body 110 may have asubstantially hexahedral shape rather than an exact hexahedron havingcompletely straight lines. The body 110 may have first and secondsurfaces 1 and 2 opposing each other in a thickness direction (a Zdirection), third and fourth surfaces 3 and 4, connected to the firstand second surfaces 1 and 2, opposing each other in a length direction(an X direction), and fifth and sixth surfaces 5 and 6, connected to thefirst and second surfaces 1 and 2 as well as to the third and fourthsurfaces 3 and 4, opposing each other in a width direction (a Ydirection).

The body 110 may be formed by alternately laminating a ceramic greensheet, on which the first internal electrode 121 is printed, and aceramic green sheet, on which the second internal electrode 122 isprinted, on the dielectric layer 111 in the thickness direction (the Zdirection).

In an example, the dielectric layers 111 and the internal electrodes 121and 122 may be alternately laminated in the first direction. A pluralityof dielectric layers 111 may be in a sintered state, and adjacentdielectric layers 111 may be integrated with each other such thatboundaries therebetween are not readily apparent without using ascanning electron microscope (SEM).

According to an embodiment, a material of the dielectric layer 111 isnot limited to any particular material as long as sufficient capacitancecan be obtained therefrom. For example, the material of the dielectriclayer 111 may be a barium titanate-based material, a lead compositeperovskite-based material, a strontium titanate-based material, or thelike.

In addition, various ceramic additives, organic solvents, plasticizers,binders, dispersants, and the like, may be added to the powder particlessuch as barium titanate (BaTiO₃), or the like, depending on the objectof the present disclosure.

For example, the dielectric layer 111 may be formed by applying anddrying slurries, formed to include powder particles such as bariumtitanate (BaTiO₃), on a carrier film to prepare a plurality of ceramicsheets. The ceramic sheet may be formed by mixing ceramic powderparticles, a binder, and a solvent to prepare slurries and forming theslurries into a sheet type having a thickness of several micrometers(μm) by a doctor blade method, but a method of forming the ceramic sheetis not limited thereto.

In an example, an average thickness of the dielectric layer 111 may be0.4 μm or less. The average thickness of the dielectric layer 111 may bean average of values measured in five different points of the sintereddielectric layer 111. A lower limit of the average thickness of thedielectric layer 111 is not limited, but may be, for example, 0.01 μm ormore.

In an example, a plurality of internal electrodes 121 and 122 may bedisposed to oppose each other with the dielectric layer 111 interposedtherebetween. The internal electrodes 121 and 122 may include a firstinternal electrode 121 and a second internal electrode 122, which arealternately disposed to oppose each other with the dielectric layer 111therebetween.

The first internal electrode 121 may be exposed to one surface of thebody 110 in the second direction (the X direction) and a portion,exposed to one surface of the body 110 in the second direction (the Xdirection), may be connected to the first external electrode 131. Thesecond internal electrode 122 may be exposed to the other surface of thebody 110 in the second direction (the X direction) and a portion,exposed to the other surface of the body 110 in the second direction(the X direction), may be connected to the external electrode 132. Thefirst and second internal electrodes 121 and 122 may be electricallyseparated from each other by the dielectric layer 111 disposedtherebetween.

A material of the first and second internal electrodes 121 and 122 isnot limited, and the first and second internal electrodes 121 and 122may be formed using a conductive paste including at least one, forexample, silver (Ag), palladium (Pd), gold (Au), platinum (Pt), nickel(Ni), copper (Cu), tin (Sn), tungsten (W), palladium (Pd), titanium(Ti), or alloys thereof.

As the printing method of the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

An average thickness of the first and second internal electrodes 121 and122 may be 0.4 μm or less. The average thickness of the internalelectrode may be an average of values measured in five differentlocations of a sintered internal electrode. A lower limit of the averagethickness of the first and second internal electrodes 121 and 122 is notlimited, but may be, for example, 0.01 μm or more.

An indentation may be disposed at at least one of a boundary between thefirst internal electrode 121 and the first external electrode 131 and aboundary between the second internal electrode 122 and the secondexternal electrode 132.

FIGS. 4 and 5 illustrate indentations 151 and 152. Referring to FIGS. 4and 5 , the indentation 151 is disposed at a boundary between the firstinternal electrode 121 and the first external electrode 132, and theindentation 152 may be disposed at a boundary between the secondinternal electrode 122 and the second external electrode 132. A methodof forming the indentations 151 and 152 is not limited. For example, theindentations 151 and 152 may be formed by adjusting a composition and/ora content of a metal, included in an internal electrode, and using asintering rate difference from a ceramic layer during a sinteringprocess. Alternatively, the indentations 151 and 152 may be formed byadjusting a content of a glass material, included in an externalelectrode, and using the glass material exuded when the externalelectrode is sintered. Such an indentation may serve to significantlyreduce occurrence of a defect in spite of permeation of externalmoisture while maintaining a contact with an external electrode.

In an example, the indentations 151 and 152 may include a glass. Inother words, a glass may fill the indentations 151 and 152. The glassmay fill at least 20% of the indentations 151 and 152, which may referto the number of indentations, filled with the glass, among theindentations. A method of forming the indentation to include a glass isnot limited. For example, a glass material, included in the conductivepaste for external electrodes to be described later, may exude duringsintering of the external electrode to form the indentation. Since theindentation includes a glass, the permeation of a plating solutionand/or external moisture may be prevented more effectively. Thus,moisture resistance reliability may be further improved. As will bedescribed later, the indentation including a glass may be formed byadding a glass material to a conductive paste for an external electrodeand exuding the glass material during a sintering process.

In an example, the indentations 151 and 152 may be disposed at anoutermost boundary of the body 110 in the first direction along theboundary between the first internal electrode 121 and the first externalelectrode 131 and the boundary between the second internal electrode 122and the second external electrode 132. FIG. 7 is a schematic diagram ofa dielectric layer and an internal electrode included in a bodyaccording to the present embodiment. Referring to FIG. 7 , indentations151 and 152 may be present in an outermost boundary of a body 110 in afirst direction, among a boundary between a first internal electrode 121and a first external electrode 131 and a boundary between a secondinternal electrode 122 and a second external electrode 132. As describedabove, the indentations 151 and 152 may be disposed in the outermostboundary of the body 110 in the first direction 110, among the boundarybetween a first internal electrode 121 and a first external electrode131 and the boundary between a second internal electrode 122 and asecond external electrode 132, such that moisture resistance reliabilityof an outermost region, to which a plating solution and externalmoisture are most apt to permeate, may be improved.

In another example, the indentations 251 and 252 may be disposed at aboundary between the first internal electrode 221 and the first externalelectrode 131 and a boundary between the second internal electrode 222and the second external electrode 132, and may be disposed in both theboundaries. FIG. 8 is a schematic view illustrating a dielectric layerand the internal electrode included in the body according to the presentembodiment. Referring to FIG. 8 , indentations may be disposed inboundaries where all of the first and second internal electrodes 221 and222 and the first and second external electrodes 131 and 132, includedin a body 110, meet. In other words, an indentation may be formed on thefirst and second internal electrodes 221 and 222 exposed in a seconddirection (an X direction). In this case, reliability of moistureresistance against permeation of external moisture may be significantlyimproved.

In an embodiment, the sum of widths of the indentations 151 and 152 ofthe first internal electrode 121 or the second internal electrode 122may range from 30% to 80% of an overall width of the first internalelectrode 121 or the second internal electrode 122. The sum of thewidths of the indentations of the first internal electrode 121 may referto a dimension obtained by adding all widths of the indentations 151formed in the first internal electrode 121 in a third direction (a Wdirection), and may refer to, for example, the sum of widths of theindentations 151 formed in a surface of the first internal electrode 121closest to the first external electrode 131. In addition, the sum of thewidths of the indentations 152 of the second internal electrodes 122 mayrefer to a dimension obtained by adding all widths of the indentations152 formed in the second internal electrodes 122 in the third direction(the W direction), and may refer to, for example, the sum of widths ofthe indentations 152 formed on a surface of the second internalelectrode 122 closest to the second external electrode 132. The overallwidth of the first internal electrode 121 or the second internalelectrode 122 may refer to a dimension of the first internal electrodeand the second internal electrode in the Y direction, and may correspondto a dimension obtained by adding a width of a portion, in which thefirst and second internal electrodes are in contact with the first andsecond external electrodes, and the sum of the widths of theindentation. When the sum of the widths of the indentations 151 and 152of the first internal electrode 121 or the second internal electrode 122with respect to the overall width of the first internal electrode 121 orthe second internal electrode 122 satisfies the above range, occurrenceof a defect, caused by permeation of external moisture, may besignificantly reduced.

In an embodiment, each of the indentations 151 and 152 may have adimension t1 of 5 μm or less. The dimension t1 of each of theindentations 151 and 152 may refer to a dimension of each of theindentations 151 and 152 in a second direction (an X direction). FIG. 6is a schematic diagram illustrating a dimension t1 of an indentationaccording to the present embodiment. Referring to FIG. 6 , when viewedin the Y direction, the dimension t1 of the groove may refer to adimension at which an internal electrode and an external electrode arenot in contact with each other. When the dimension of each of theindentations 151 and 152 is greater than 5 μm, contactability betweenthe internal electrodes 121 and 122 and the external electrodes 131 and132 may be deteriorated. A lower limit of the dimension of each of theindentations 151 and 152 is not limited, but may be, for example,greater than 0 μm and 0.01 μm or more. When the dimension of each of theindentations 151 and 152 is less than the above range, contactabilityfailure between the internal electrodes 121 and 122 and the externalelectrodes 131 and 132 may occur and the moisture resistance reliabilitymay be deteriorated.

In another embodiment, a glass layer may be disposed on the boundarybetween the first internal electrode 121 and the first externalelectrode 131 and/or the boundary between the second internal electrode122 and the second external electrode 132. The glass layer may be exudedduring a sintering process of the glass included in the internalelectrode and/or the external electrode. The glass layer may serves toblock external moisture, or the like, and may have a thicknessappropriately selected within a range which does not affectcontactability. The thickness of the glass layer may be, for example, 5μm or less. A lower limit of the thickness of the glass layer is notlimited, but may be, for example, more than 0 μm and 0.01 μm or more.

In an embodiment, first and second cover portions 123 and 124 may bedisposed on the outermost sides of the first and second internalelectrodes 121 and 122. The first and second cover portions may bedisposed below a lowermost internal electrode of the body 110 and abovean uppermost internal electrode of the body 110. In this case, the lowerand upper cover portions 124 and 123, respectively, may be formed of thesame composition as the dielectric layer 111, and may be formed byrespectively laminating one or more dielectric layers, each including nointernal electrode, on the uppermost internal electrode and thelowermost internal electrode of the body 110.

The first and second cover portions 123, 124 may serve to prevent aninternal electrode from being damaged by physical or chemical stress.

A thickness of each of the first and second cover portions 123, 124 isnot limited, but may be, for example, 25 μm or less. Capacitance perunit volume of the capacitor component 100 may be improved bysignificantly decreasing the thickness of each of the first and secondcover portions.

In addition, a lower limit of the thickness of each of the first andsecond cover portions 123, 124 is not limited and may be appropriatelyselected in consideration of a radius of curvature R1 of body edges onend surfaces in first and second directions, for example, 5 μm or more.

The thickness of each of the first and second cover portion 123, 124 mayrefer to a dimension in the first direction (the X direction) of thefirst and second cover portions 123, 124.

In an example, the first external electrode 131 and the second externalelectrode 132 may be disposed on both external surfaces of the body 110in the second direction, respectively. The first external electrode 131may be electrically connected to the first internal electrode 121, andthe second external electrode 132 may be electrically connected to thesecond internal electrode 122.

The first and second external electrodes 131 and 132 may be disposed toextend to both external surfaces of the body 110 in the first direction(the Z direction) and to extend in the third direction (the Ydirection). In this case, the first and second external electrodes 131and 132 may extend to portions of the first and second surfaces 1 and 2of the body 110. The first and second external electrodes 131 and 132may also extend to portions of the fifth and sixth surfaces 5 and 6 ofthe body 110.

The first and second external electrodes 131 and 132 may include copper(Cu) in highest content, but a material of the first and second externalelectrodes 131 and 132 is not limited thereto. For example, the firstand second external electrodes 131 and 132 may be formed using aconductive paste including a glass and at least one of silver (Ag),palladium (Pd), and gold (Au), platinum (Pt), nickel (Ni), tin (Sn),tungsten (W), palladium (Pd), titanium (Ti), and alloys thereof. Theconductive paste may be printed by a screen-printing method, a gravureprinting method, or the like, but a printing method of the conductivepaste is not limited thereto. Since the first and second externalelectrodes are formed using the above-mentioned conductive paste,density of an external electrode may be increased by the added glass toeffectively suppress permeation of a plating solution and/or externalmoisture while maintaining sufficient conductivity.

A glass material, included in the first and second external electrodes131 and 132, may have a composition in which oxides are mixed, but isnot limited and may be at least one selected from the group consistingof silicon oxide, boron oxide, aluminum oxide, transition metal oxide,alkali metal oxide, and alkaline earth metal oxide. The transition metalmay be selected from the group consisting of zinc (Zn), titanium (Ti),copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni),the alkali metal may be selected from the group consisting of lithium(Li), sodium (Na) and potassium (K), and the alkaline earth metal may beat least one selected from the group consisting of magnesium (Mg),calcium (Ca), strontium (Sr), and barium (Ba).

In an example, a central portion of each of the first and secondexternal electrodes 131 and 132 may have a thickness ranging from 1 μmto 10 μm. The thickness of the central portion of each of the externalelectrodes 131 and 132 may be a value measured in an intersection oflines, connecting corners facing each other, based on the four cornersof a surface on which the external electrode is formed. When theexternal electrode has a thickness lower than the thickness, a body ofthe corner portion may be exposed. When the external electrode has athickness higher than the thickness, cracking may occur during asintering process.

In an embodiment, plating layers 131 b and 132 b may be disposed on thefirst and second electrode layers 131 a and 132 a, respectively. Theplating layers 131 b and 132 b may be formed by sputtering or electricdeposition, but a method of forming the plating layers 131 b and 132 bis not limited thereto.

The plating layers 131 b and 132 b may nickel (Ni) in highest content,but a material of the plating layers 131 b and 132 b is not limitedthereto. The plating layers 131 b and 132 b may include copper (Cu),palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb), oralloys thereof. The plating layers 131 b and 132 b may be provided toimprove mountability with a substrate, structural reliability, externaldurability against the outside, thermal resistance, and/or equivalentseries resistance (ESR).

In an example, the thickness of the central portion of each of theplating layers 131 b and 132 b may range from 3 μm to 5 μm. Thethickness of the central portion of each of the plating layers 131 b and132 b may be a value measured in an intersection of lines, connectingcorners facing each other, based on four corners of a surface on whichthe plating layers 131 b and 132 b are formed. When each of the platinglayers 131 b and 132 b has a thickness lower than the thickness,permeation of external moisture may not be effectively blocked. Wheneach of the plating layers 131 b and 132 b may have a thickness higherthan the thickness, the plating layers 131 b and 132 b may be separateddue to external heat when the substrate is mounted.

FIG. 9 is a cross-sectional view of a capacitor component according toan embodiment in the present disclosure, and FIG. 10 is an enlarged viewof portion B of FIG. 9 .

In an embodiment, as shown in FIGS. 9 and 10 , a metal oxide 361 may bedisposed on a boundary between the first electrode layer 331 a and theplating layer 331 b and a boundary between the second electrode layer332 a and the plating layer 332 b. The first electrode layer 331 a isconnected to first internal electrode 321 and the second electrode layeris connected to second internal electrode 322. The metal oxide 361 mayhave aluminum (Al) oxide in highest content, but a material of the metaloxide 361 is not limited thereto. The metal oxide 361 may include atleast one selected from the group consisting of magnesium (Mg),manganese (Mn), nickel (Ni), lithium (Li), silicon (Si), and titanium(Ti), barium (Ba), and alloys thereof.

The metal oxide 361 may be in the form of at least one of, for example,one or more discrete islands formed on a surface of the correspondingexternal electrode, a plurality of metal oxide deposits, an amorphousmetal oxide, and a metal oxide powder, and may have a shape in which theabove forms are mixed.

The metal oxide 361 may be generated during a polishing process using ametal oxide polishing agent to remove the glass protruding on a surfaceof the external electrode to enhance the plating connectivity, or may begenerated through wet chemical growth (for example, formation of a metaloxide and a glass-based secondary phase), partial dry physical/chemicalgrowth (PVD/CVD, or the like), or the like, on a portion of the externalelectrode before plating.

The metal oxide 361 may be disposed on boundaries between the externalelectrodes 361 a and 362 a and the plating layers 361 b and 362 b toprevent a chip internal defect, caused by permeation of the platingsolution, and to prevent moisture from permeating due to a defect in aboundary between an external electrode and a plating layer, which maycontribute to improvement in moisture resistance reliability of acapacitor component.

The metal oxide 361, disposed in the boundary between the externalelectrode and the plating layer, may have a dimension ranging from 5% to90% with respect to an overall dimension of the boundary between theexternal electrode and the plating layer. The dimension of the metaloxide 361 may be based on any one end surface of the capacitor componentand may be, for example, a value measured based on an end surfaceperpendicular to the internal electrode or a surface parallel to theinternal electrode. For example, in the end surface perpendicular to theinternal electrode with respect to the capacitor component (for example,the surface passing through the center of the capacitor component), thedimension of the metal oxide may be based on the overall dimension ofthe boundary between the external electrode and the plating layer andmay be a ratio of the dimension of the metal oxide exposed to the endsurface. The ratio may be an average of values measured in fivedifferent points of the capacitor component.

The ratio may be adjusted within a range in which there is nointerference with the plating growth, for example, 90% or less, 80% orless, 70% or less, 60% or less, 50% or less, 45% or less, 40% or less,38% or less, 37% or less, 36% or less, or 35% or less, but is notlimited thereto. In addition, a lower limit of the ratio may be, forexample, 1% or more, 2% or more, 3% or more, 4% or more, 5% or more, 6%or more, 7% or more, or 7.5% or more, but is not limited thereto. Whenthe ratio of a dimension, at which the metal oxide is present, satisfiesthe above range, discontinuity of the plating layer may not occur whileimproving the moisture resistance reliability.

Table 1 illustrates contactability, high temperature/high pressurereliability, and moisture resistance reliability depending on adimension of an indentation. Table 1 targeted a capacitor component inan indentation was formed in each internal electrodes, and targeted acapacitor component in which the sum of widths of indentations rangedfrom 30 to 80% of a width of the internal electrode. In Table 1, a case,in which contactability was out of ±30% with respect to upper and lowerlimits of reference capacitance dose, was evaluated as failure. In termsof high temperature/high pressure reliability failure, when a voltage of2 Vr was applied at 150 degrees Celsius, the number of capacitorcomponents, in which a failure occurred, among 400 samples, wasexamined. In terms of moisture resistance reliability failure, when avoltage of 1 Vr was applied at 85 degrees Celsius and 85% RH, and thenumber of capacitor components in which failure occurred, among 400samples, was examined.

TABLE 1 HIGH TEMPERATURE/ DIMENSION OF HIGH PRESSURE AND INDENTATIONCONTACTABILITY MOISTURE RESISTANCE (t1) FAILURE RELIABILITY FAILURE  0μm  20/400 12/400, 15/400  5 μm  18/400 0/400, 0/400 10 μm 251/400 NOTEVALUATED

From Table 1, it can be seen that high temperature/high pressurereliability and moisture resistance reliability were furthersignificantly deteriorated when an indentation has a dimension of 0 μmthan when the indentation has a dimension of 5 μm, and contactabilityfailure was significantly increased when the indentation has a dimensionof 10 μm.

Table 2 illustrates plating connectivity and a chipping rate to apresence ratio of a metal oxide between an external electrode and aplating layer. A capacitor component of Table 2 was manufactured byphysically etching an external electrode glass using an Al₂O₃ polishingagent and performing a subsequent process after adjusting a removalratio of the polishing agent (Manner 1).

In Table 2, a ratio of a metal oxide was obtained by calculating a ratioof a dimension, occupied by Al₂O₃, to an overall dimension of a boundarybetween the external electrode and the plating layer in an end surfaceof a complete chip after a subsequent process. A frequency ofdiscontinuity of the plating layer was confirmed by randomly selecting10 manufactured capacitor components, equally dividing each of thecapacitor components to a middle portion of a body into five sections inwidth and thickness directions to both end surfaces of each of thecapacitor components in a second direction, and confirming a frequencyof discontinuity of a plating layer in respective locations. Thechipping rate was confirmed by randomly selecting 400 manufacturedcapacitor components and observing an exterior of a body portion using amicroscope to confirm a frequency.

TABLE 2 RATIO OF FREQUENCY OF FREQUENCY METAL DISCONTINUITY OF OF OXIDEPLATING LAYER CHIPPING  0% 2/100 8/100  5% 0/100 4/100 10% 0/100 0/10035% 0/100 0/100 95% 0/100 0/100

From Table 2, it can be seen that a frequency of discontinuity of aplating layer and a frequency of chipping are decreased when a metaloxide is present, and the discontinuity of the plating layer and thechipping are reduced when more than 5% of the metal oxide is present.

Table 3 illustrates plating connectivity and a chipping rate to apresence ratio of a metal oxide between an external electrode and aplating layer. A capacitor component of Table 3 was prepared bycompletely coating an amorphous metal oxide on the external electrodeusing a physical deposition manner and removing a metal oxide depositedat a predetermined rate using an Al₂O₃ polishing agent (Manner 2).

TABLE 3 RATIO OF FREQUENCY OF FREQUENCY METAL DISCONTINUITY OF OF OXIDEPLATING LAYER CHIPPING  1%   0/100 100/100  5%   0/100   9/100 10%  0/100   0/100 35%   1/100   0/100 95% 100/100   0/100

From Table 3, it can be confirmed that even if a metal oxide is formedin a manner different from the Manner 1 of Table 2, chipping occurs inall chips when 1% of a metal oxide is present, discontinuity andchipping of a plating layer are reduced when 5% of a metal oxide ispresent, and continuity occurs in all plating layers when 95% of a metaloxide is present.

Table 4 illustrates high temperature/high pressure reliability andmoisture resistance reliability depending on the above manners 1 and 2.In terms of the high temperature/high pressure reliability failure, whena voltage of 2 Vr was applied at 150 degrees Celsius, the number ofcapacitor components, in which failure occurred, among 400 samples, wasexamined. In terms of the moisture resistance reliability, when avoltage of 1 Vr was applied at 85 degrees Celsius and 85% RH, and thenumber of capacitor components, in which failure occurred, among 400samples, was examined.

TABLE 4 HIGH TEMPERATURE/ HIGH MOISTURE PRESSURE RESISTANCE RELIABILITYRELIABILITY CLASSIFICATION FAILURE FAILURE NOT APPLY 5/400 8/400 MANNERS1 AND 2 APPLY MANNER 1 0/400 0/400 APPLY MANNER 2 0/400 0/400

From Table 4, it can be seen that Manner 1 (a glass of an externalelectrode portion of a manufactured capacitor component is physicallyetched and a ratio of a polishing agent is adjusted) and Manner 2 (anamorphous metal oxide is deposited on an external electrode of acapacitor component and the deposited metal oxide is removed at aconstant rate) exhibit improved high temperature/high pressurereliability and improved moisture resistance reliability even if a ratioof a metal oxide is adjusted in different manners. As a result, it isconfirmed that high temperature/high pressure reliability and moistureresistance reliability of a capacitor component according to the presentdisclosure are not changed depending on a manufacturing method, but areimproved depending on a presence ratio of a metal oxide.

As described above, according to an embodiment, an indentation may bedisposed at a boundary between an internal electrode and an electrodelayer to significantly reduce a defect caused by permeation of externalmoisture while securing contactability with an external terminal.

According to another embodiment, an indentation may be disposed betweenan internal electrode and an electrode layer at a predetermined size anda predetermined ratio to prevent reliability of an electronic componentfrom being deteriorated by permeation of a plating solution or moisture.

According to another embodiment, a meal oxide may be disposed on aboundary between an electrode layer and a plating layer to preventcracking caused by an external impact or the like.

According to another embodiment, a metal oxide layer may be disposedbetween an electrode layer and a plating flayer to improve moistureresistance reliability.

While example embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A capacitor component comprising: a bodyincluding a dielectric layer, a first electrode and a second internalelectrode, laminated in a first direction of the body, opposing eachother, and a first cover portion and a second cover portion, disposed onoutermost surfaces of the first and second internal electrodes, eachhaving a thickness of 25 μm or less; a first electrode layer and asecond electrode layer, respectively disposed on both external surfacesof the body in a second direction of the body different from the firstdirection and respectively connected to the first and second internalelectrodes; and a first plating layer disposed on the first electrodelayer and a second plating layer disposed on the second electrode layer,wherein a metal oxide is disposed on a boundary between the firstelectrode layer and the first plating layer and a boundary between thesecond electrode layer and the second plating layer, wherein in across-section perpendicular to the first direction, a plurality ofindentations are disposed on a boundary between the first internalelectrode and the first electrode layer or a boundary between the secondinternal electrode and the second electrode layer, and wherein theplurality of indentations are arranged between opposing edges of thefirst internal electrode or the second internal electrode in a thirddirection perpendicular to the first direction.
 2. The capacitorcomponent of claim 1, wherein the metal oxide has at least one of anisland, a plurality of metal oxide deposits, an amorphous metal oxide,and a metal oxide powder.
 3. The capacitor component of claim 1, whereineach of the first and second electrode layers includes a glass material.4. The capacitor component of claim 1, wherein each of the first andsecond electrode layers includes copper (Cu).
 5. The capacitor componentof claim 1, wherein a central portion of each of the first and secondexternal electrode layers has a thickness ranging from 1 μm to 10 μm. 6.The capacitor component of claim 1, wherein the plating layer includesnickel (Ni).
 7. The capacitor component of claim 1, wherein theindentation includes a glass.
 8. The capacitor component of claim 1,wherein the indentation is disposed at an outermost boundary of the bodyin the first direction, among the boundary between the first internalelectrode and the first electrode layer and the boundary between thesecond internal electrode and the second electrode layer.
 9. Thecapacitor component of claim 1, wherein the indentation is disposed at aboundary between the first internal electrode and the first electrodelayer and a boundary between the second internal electrode and thesecond electrode layer.
 10. The capacitor component of claim 1, whereina sum of widths of the indentations ranges from 30% to 80% of an overallwidth of the internal electrodes.
 11. The capacitor component of claim1, wherein the indentation has a dimension of 5 μm or less.
 12. Thecapacitor component of claim 1, wherein an average thickness of thefirst and second internal electrodes is in a range from 0.01 μm to 0.4μm.
 13. The capacitor component of claim 1, wherein an average thicknessof the dielectric layer is in a range from 0.01 μm to 0.4 μm.
 14. Acapacitor component comprising: a body including a first internalelectrode, a second internal electrode opposing the first internalelectrode in a first direction of the body, and a dielectric layerinterposed between the first and second internal electrodes; a firstelectrode layer connected to the first internal electrode and a secondelectrode layer opposing the first electrode layer in a second directionof the body different from the first direction; a first plating layerdisposed on the first electrode layer and a second plating layerdisposed on the second electrode layer; and a metal oxide disposed at aboundary between the first plating layer and the first electrode layer,and a boundary between the second plating layer and the second electrodelayer, wherein in a cross-section perpendicular to the first direction,a plurality of indentations are disposed on a boundary between the firstinternal electrode and the first electrode layer or a boundary betweenthe second internal electrode and the second electrode layer, andwherein the plurality of indentations are arranged between opposingedges of the first internal electrode or the second internal electrodein a third direction perpendicular to the first direction.
 15. Thecapacitor component of claim 14, wherein the metal oxide has a dimensionin a range from 5% to 90% of that of the boundary between the platinglayer and a corresponding electrode layer.
 16. The capacitor componentof claim 14, wherein a total dimension of indentations disposed at agiven boundary ranges from 30% to 80% of a dimension of the givenboundary.
 17. The capacitor component of claim 14, wherein the metaloxide is disposed at a given boundary as islands, plurality of discretedeposits or a combination thereof.
 18. The capacitor component of claim14, wherein the metal oxide comprises an amorphous metal oxide, a metaloxide powder, or a combination thereof.